Organic contaminants are known to affect pyramid size during wafer texturing process. Organics from wafer handling and transport plastic containers, process operators, ambient air, forklifts and adhesive are commons contaminants found in cell manufacturing. It is imperative to understand the source of organics and develop cleaning chemistries for organics removal prior to texturing process.


Organic outgassing of wafer by automated thermal desorption gas chromatography - mass spectrometry for detection of C7-C30 chained volatile organics


Speciation and semi-quantitative analysis of volatile organics collected on processed and witness wafers


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