The manufacturing of integrated circuits free of micro-contamination drives the recent increase in demand for clean tool components (new and refurbished). Tool component manufacturers and cleaning vendors therefore highly benefit from the reliable analytical testing techniques that are critical to cleaning process monitoring and troubleshooting.
Traditional analytical techniques such as SIMS, AES, and EDX are considered acceptable for detection of inorganic and organic contamination on a 4"x4" coupon. However, these techniques cannot be relied upon to perform tests on actual parts and tool components due to:
- limitation of analytical instrument chamber size. The reduction of component size is not only costly, but it can also add contamination.
- low sensitivity in measuring contamination at levels required for 20nm technology and beyond.
ChemTrace offers solutions to the limitations of traditional analytical techniques. Our expertise in nondestructive techniques makes us the analytical lab of choice for many of the largest semiconductor tool manufacturers and integrated circuit fabs. Techniques we have developed are suitable for characterizing the cleanliness of coupons, surface finishes for new and used parts, and 200mm, 300mm, and 450mm tool components made from various materials.
Our expertise extends to correlating post-cleaned parts with wafer surface contamination after chamber processing, or after wafer contact with the cleaned surface. We establish cleaning specifications for tool parts by utilizing the Tool Specification Cycle, which is composed of cleaning the part, verifying the part’s cleanliness, processing wafers using the cleaned part, and characterizing the wafer. Wafer contamination levels after IC processing are used as the benchmark to set the cleaning specification. The Tool Specification Cycle may also be used to identify and troubleshoot problematic parts that cause low MWBC (mean wafer between clean) or wafer contamination levels that do not meet processing specification.
NON-DESTRUCTIVE TOOL COMPONENTS ANALYSIS ANSWERS TO HOW CLEAN IS CLEAN
- Trace Metals
- Particle Counts
- Anions and Cations
- Volatile Organics
- Elemental Analysis of Particle
- Extractable Organics
- ChemTrace Novel Techniques
- Acidic extraction ICP-MS/ICP-OES
- Ultrapure Water Extraction LPC
- Ultrapure Water Extraction Ion Chromatography
- ATD GC-MS
- No size limitation (coupons to 450mm parts)
- More representative due to large analysis surface area
- Analytical sensitivities meet 20nm technology requirement
- Results are quantitative
- Non-destructive analysis
Acidic Extraction ICP-MS/ICP-OES for Trace Metals
WHAT IS ACIDIC EXTRACTION ICP-MS?
Localized wet chemistry/dilute acid extraction of tool component and analysis of extract solution by ICP-MS / ICP-OES
- Typical analysis surface area is 2" diameter however varies depending on part configuration
- Acid chemistry varies by coating or substrate material
- Acid chemistry in contact with tool component for a predetermined time
|Pre Clean||Post Clean|
Ultrapure Water Extraction LPC for Particle Counts
HOW PARTICLE RESULTS ARE CALCULATED
The particle counts results are averages of particles detected in part extract less particles detected in vessel extract normalized across surface area of the part or coupon
5 standard ranges of particles ≥ 0.2µm, ≥ 0.3µm, ≥ 0.5µm, ≥ 1.0µm and ≥ 2.0µm
Anions and Cations by Ion Chromatography
WHAT DOES THIS TECHNIQUE DETECT?
It detects residual acid or base cleaning chemistries after rinsing step.
Anions and cations to include F-, Cl- NO2-, Br-, NO3-, SO42-, PO43-, Li+, Na+, NH4+, K+, Mg2+, Ca2+
Volatile Organics (C - C30) by ATD GC-MS
|Response Time (min)||OUTGASSING COMPOUNDS||Concentration (ng)|
|10.33||1 - Hexanol, 2-ethyl-||10|
|14.41||Alkyl subsituted benzene||6.7|
|16.0 - 37.5(broad peak)||Mixture of branched hydrocarbons||77,000|
Cutting Fluid Analysis by GC-MS
|R.T. (min)||Tentatively Assigned Compounds||% of Total Area Response|
|17.21||Mixture of hydrocarbons (major)||95%|
Electronics and Nanotechnology
For more information, please contact us:
Technology Center and Principal Laboratory
44050 Fremont Blvd
Fremont, California 94538
12130 NE Ainsworth Circle Suite 210
Portland, Oregon 97220
Paltan myeon, Hwaseong-si,
1939 Hereford Drive
Irving, TX 75038
No.9, Datong Road
Hukou Township Hsinchu County
30352, Taiwan (R.O.C.)