Tool Components/Parts

The manufacturing of integrated circuits free of micro-contamination drives the recent increase in demand for clean tool components (new and refurbished). Tool component manufacturers and cleaning vendors therefore highly benefit from the reliable analytical testing techniques that are critical to cleaning process monitoring and troubleshooting.

Traditional analytical techniques such as SIMS, AES, and EDX are considered acceptable for detection of inorganic and organic contamination on a 4"x4" coupon. However, these techniques cannot be relied upon to perform tests on actual parts and tool components due to:

  • limitation of analytical instrument chamber size. The reduction of component size is not only costly, but it can also add contamination.
  • low sensitivity in measuring contamination at levels required for 20nm technology and beyond.

ChemTrace offers solutions to the limitations of traditional analytical techniques. Our expertise in nondestructive techniques makes us the analytical lab of choice for many of the largest semiconductor tool manufacturers and integrated circuit fabs. Techniques we have developed are suitable for characterizing the cleanliness of coupons, surface finishes for new and used parts, and 200mm, 300mm, and 450mm tool components made from various materials.

Our expertise extends to correlating post-cleaned parts with wafer surface contamination after chamber processing, or after wafer contact with the cleaned surface. We establish cleaning specifications for tool parts by utilizing the Tool Specification Cycle, which is composed of cleaning the part, verifying the part’s cleanliness, processing wafers using the cleaned part, and characterizing the wafer. Wafer contamination levels after IC processing are used as the benchmark to set the cleaning specification. The Tool Specification Cycle may also be used to identify and troubleshoot problematic parts that cause low MWBC (mean wafer between clean) or wafer contamination levels that do not meet processing specification.

NON-DESTRUCTIVE TOOL COMPONENTS ANALYSIS ANSWERS TO HOW CLEAN IS CLEAN

  • Verification
  • Trace Metals
  • Particle Counts
  • Anions and Cations
  • Volatile Organics
  • Elemental Analysis of Particle
  • Extractable Organics
  • ChemTrace Novel Techniques
  • Acidic extraction ICP-MS/ICP-OES
  • Ultrapure Water Extraction LPC
  • Ultrapure Water Extraction Ion Chromatography
  • ATD GC-MS
  • SEM-EDX
  • GC-MS
  • No size limitation (coupons to 450mm parts)
  • More representative due to large analysis surface area
  • Analytical sensitivities meet 20nm technology requirement
  • Results are quantitative
  • Non-destructive analysis

Acidic Extraction ICP-MS/ICP-OES for Trace Metals

WHAT IS ACIDIC EXTRACTION ICP-MS?

Localized wet chemistry/dilute acid extraction of tool component and analysis of extract solution by ICP-MS / ICP-OES

  • Typical analysis surface area is 2" diameter however varies depending on part configuration
  • Acid chemistry varies by coating or substrate material
  • Acid chemistry in contact with tool component for a predetermined time
ELEMENTS QUARTZ WINDOW
Pre Clean Post Clean
Aluminum (Al) 58,000 63
Barium (Ba) 820 <0.3
Calcium (Ca) 100,000 82
Chromium (Cr) 140 <5
Copper (Cu) 6,400 <2
Iron (Fe) 7,900 5.5
Lead (Pb) 400 <0.1
Lithium (Li) 1,400 <3
Magnesium (Mg) 23,000 <10
Nickel (Ni) 580 <2
Potassium (K) 950 <10
Sodium (Na) 2,700 20
Titanium (Ti) 1,600 <5
Yttria (Y) 2,600 <2
Zinc (Zn) 1,100 21
Surface concentration in E10 atoms/cm2

Ultrapure Water Extraction LPC for Particle Counts

HOW PARTICLE RESULTS ARE CALCULATED

The particle counts results are averages of particles detected in part extract less particles detected in vessel extract normalized across surface area of the part or coupon

5 standard ranges of particles ≥ 0.2µm, ≥ 0.3µm, ≥ 0.5µm, ≥ 1.0µm and ≥ 2.0µm

Anions and Cations by Ion Chromatography

WHAT DOES THIS TECHNIQUE DETECT?

It detects residual acid or base cleaning chemistries after rinsing step.

Anions and cations to include F-, Cl- NO2-, Br-, NO3-, SO42-, PO43-, Li+, Na+, NH4+, K+, Mg2+, Ca2+

Volatile Organics (C - C30) by ATD GC-MS

Response Time (min) OUTGASSING COMPOUNDS Concentration (ng)
8.26 Hexylene Glycol 280
9.42 Phenol 7.4
10.33 1 - Hexanol, 2-ethyl- 10
11.69 Nonanal 4.7
12.51 Cyclopentasiloxane, decamethyl 5.1
12.67 Benzoic Acid 25
13.27 Hydrocarbon 4.2
14.05 Propanol, phenoxy 590
14.22 17
14.41 Alkyl subsituted benzene 6.7
14.79 Hydrocarbon 4.1
15.16 Cyclohexasiloxane, dodecamethyl- 4.7
15.22 Napthalene compound 7.5
15.33 Hydrocarbons 4.2
15.49 6.2
15.56 7.1
15.74 Dimetridazole 26
16.0 - 37.5(broad peak) Mixture of branched hydrocarbons 77,000

Cutting Fluid Analysis by GC-MS

R.T. (min) Tentatively Assigned Compounds % of Total Area Response
7.06 Hexylene glycol 2.9%
10.45 Propanol, phenoxy- 2.2%
17.21 Mixture of hydrocarbons (major) 95%
  • High levels of organic impurities on coupon detected by ATD GC-MS
  • Residual organic impurities from cutting fluid were not efficiently removed during cleaning process

Inquiries

For more information, please contact us

Technology Center and Principal Laboratory

44050 Fremont Blvd

Fremont, California 94538

Phone: 510-687-8000

Satellite Laboratory

12130 NE Ainsworth Circle Suite 210

Portland, Oregon 97220

Phone: 503-254-2828

Email: Info@ChemTrace.com